OCT3032

Wireless SoC by Octasic Inc

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OCT3032 Image

The OCT3032W from Ocstasic is a high-performance, low-power SoC for 4G LTE and 5G applications. The SoC supports 5G New Radio (NR) for both Non-Standalone (NSA) and Standalone (SA) deployments with throughputs up to 800/300 Mbps for downlink/uplink. It has a multi-core digital signal processor (DSP), coupled with an on-chip 800 MHz quad-core Arm® Cortex®-A7 processor that provides high processing capacity per watt for mission-critical wireless applications including 2G to 5G small cells, femtocells, network-in-a-box (NiB), private wireless networks, tactical communications, public safety and Industrial Internet of Things (IIoT) networks. It consumes 0.5 to 8 W of power, depending on the application.

The OCT3032W comprises of up to 32 Opus3 DSP cores, a wireless accelerator group, a CPU complex, a total of 18 MB of internal memory, and various peripheral interfaces. Its Crossbar Interconnect (XBC) provides a 90 Gbps high-bandwidth interconnect between the DSP cores, CPU complex, peripherals, and external memory. The SoC is available in a 900-pin flip-chip ball grid array (FCBGA) packaging that measures 25 x 25 x 0.8 mm. 

Product Specifications

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Product Details

  • Part Number
    OCT3032
  • Manufacturer
    Octasic Inc
  • Description
    Low-Power, High-Performance SoC for 4G LTE and 5G Applications

General Parameters

  • Application
    Wireless network infrastructure and handheld user equipment, 5G and LTE-A small cells, Industrial Internet of Things (IIoT), Private wireless networks, Tactical communications, Network-in-a-box (NiB) applications
  • Frequency
    400 MHz to 6 GHz (OctNode Platform)
  • Data Rate
    300 to 800 mbps
  • Output Power
    8 W
  • GPIOs
    32 Pin
  • Interface
    Ethernet, I2C, PCIe, USB 2.0, UART
  • MIMO
    Yes
  • RF Transceiver
    Yes
  • ROHS
    Yes
  • Dimension
    25mm x 25mm x 0.8mm
  • Package
    900-pin Flip Chip Ball Grid Array (FCBGA)

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