RF & Microwave Laminates

82 Laminates from 2 Manufacturers meet your specification.
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  • Manufacturers : Taconic, Isola Group
Description:Halogen-free, Very Low Loss RF/Microwave Laminate
Dk (Dielectric Constant):
3.45
Df (Dissipation Factor):
0.0032
Tg:
200 Degrees C
Td:
390 Degrees C
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Description:Thermally Stable Composite based on Nanotechnology and PTFE
Dk (Dielectric Constant):
2.80
Df (Dissipation Factor):
0.0012
Thickness:
0.13 mm
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Description:Low-Loss Laminate Material for RF & Microwave Applications
Dk (Dielectric Constant):
3.48
Df (Dissipation Factor):
0.0029
Tg:
200 Degrees C
Td:
360 Degrees C
Thickness:
1.5 mm
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Description:FEP 200-70 RF Bonding Film, Thermoplastic bonding film
Dk (Dielectric Constant):
2
Df (Dissipation Factor):
0.0003
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Description:Low-Loss Laminate Materials for Aerospace & Defense Applications
Dk (Dielectric Constant):
3 / 3.38 / 3.45 / 3.48
Df (Dissipation Factor):
0.0020 to 0.0029
Tg:
200 Degrees C
Td:
360 Degrees C
Thickness:
0.51, 0.76, 1.5 mm
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Description:CER-10 RF & Microwave Laminate, High DK Material, easily fabricated
Dk (Dielectric Constant):
10.0 nominal +/- 0.50
Df (Dissipation Factor):
0.0035
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Description:FR-4 Process Compatible Low-loss Laminate Material
Dk (Dielectric Constant):
3.45
Df (Dissipation Factor):
0.0031
Tg:
200 Degrees C
Td:
360 Degrees C
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Description:Aluminium and copper backed IMS materials for LED applications
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Description:Very Low Loss FR-4 Process Compatible Laminate for mm-Wave Frequencies
Dk (Dielectric Constant):
3
Df (Dissipation Factor):
0.0017
Tg:
200 Degrees C
Td:
360 Degrees C
Thickness:
0.0635 to 1.50 mm
more info
Description:TRF-43 High Performance Laminate
Dk (Dielectric Constant):
4.3 +/- 0.15
Df (Dissipation Factor):
0.0035
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