RF & Microwave Laminates

15 Laminates from 2 Manufacturers meet your specification.
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  • Manufacturers : W. L. Gore & Associates, Park Electrochemical Corp
  • Tg : 0 to 200 Degrees C
Description:Ultra Low Loss Laminate and Prepreg Operates up to 25 GHz
Dk (Dielectric Constant):
3.5
Df (Dissipation Factor):
0.0020 to 0.0028
Tg:
200 Degrees C
Td:
390 Degrees C
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Description:Laminate with Dielectric Thickness of 2.8
Dk (Dielectric Constant):
2.8
Tg:
155 Degree C
Thickness:
0.03 to 0.06 mm
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Description:Copper-Clad Laminate for RF Applications
Dk (Dielectric Constant):
3.5
Df (Dissipation Factor):
0.0032 to 0.0038
Tg:
170 to 200 Degrees C
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Description:Thermally Robust, High Speed, Low Loss Epoxy
Dk (Dielectric Constant):
3.3 at 10 GHz
Tg:
200 °C
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Description:Low CTE Multifunctional Epoxy
Dk (Dielectric Constant):
4.5 at 1 MHz, 4 at 1 GHz
Tg:
155 °C
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Description:Fast-Cure, High Tg Multifunctional Epoxy
Dk (Dielectric Constant):
4.3 at 1 MHz, 4.1 at 1 GHz
Tg:
175 °C
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Description:High Tg Multifunctional Epoxy
Dk (Dielectric Constant):
4.3 at 1 MHz, 4.1 at 1 GHz
Tg:
175 °C
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Description:Low CTE Multifunctional Epoxy
Dk (Dielectric Constant):
4 at 1 MHz, 3.6 at 1 GHz
Tg:
155 °C
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Description:Low CTE, High Tg Multifunctional Epoxy
Dk (Dielectric Constant):
4.3 at 1 MHz, 4.1 at 1 GHz
Tg:
175 °C
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Description:Thermally Robust, High Speed, Low Loss Epoxy
Dk (Dielectric Constant):
3.8 at 10 GHz
Tg:
200 °C
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