RF & Microwave Laminates

26 Laminates from 3 Manufacturers meet your specification.
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  • Manufacturers: W. L. Gore & Associates, Park Electrochemical Corp, Shengyi Technology Co, Ltd
  • Tg: 200 to 1000 Degrees C
Description:Ultra Low Loss Laminate and Prepreg Operates up to 25 GHz
Dk (Dielectric Constant):
3.5
Df (Dissipation Factor):
0.0020 to 0.0028
Tg:
200 Degrees C
Td:
390 Degrees C
more info
Description:Copper-Clad Laminate for RF Applications
Dk (Dielectric Constant):
3.5
Df (Dissipation Factor):
0.0032 to 0.0038
Tg:
170 to 200 Degrees C
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Description:Laminate with Dielectric Thickness of 2.7
Dk (Dielectric Constant):
2.7
Tg:
220 Degree C
Thickness:
0.057 to 0.086 mm
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Description:Laminate with Dielectric Thickness of 2.6
Dk (Dielectric Constant):
2.6
Tg:
220 Degree C
Thickness:
0.038 to 0.086 mm
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Description:Laminate with Dielectric Thickness of 2.6
Dk (Dielectric Constant):
2.6
Tg:
220 Degree C
Thickness:
0.057 to 0.086 mm
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Description:Laminate with Dielectric Thickness of 3.3 to 3.4
Tg:
220 Degree C
Thickness:
0.063 mm
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Description:High-Frequency Low Loss Laminate
Dk (Dielectric Constant):
3.42 to 3.61
Df (Dissipation Factor):
0.003
Tg:
280 Degree C
Td:
390 Degree C
Thickness:
0.254 to 1.52 mm
more info

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