Probe Cards

35 Probe Cards from 6 manufacturers listed on everything RF

Probe Cards from the leading manufacturers are listed below. Use the filters to narrow down on products based on your requirement. Download Datasheets, Compare products and Request Quotations. Your Inquiry will be directed to the manufacturer and their distributors who will get back to you with a quote.

Description:RF Probe Card
Features:
Suitable formuli-die test, including peripheral pa...
more info
Description:74 μm Probe Card up to 10 GHz
Pitch:
74 µm
Frequency:
up to 10 GHz
Features:
Measurement accuracy : Excellent signal integrity,...
Pad Material:
Al, Cu, Au, all types of solder balls
more info
Description:80 um Pitch Probe Card
Pitch:
80 um
Features:
MEMS wire needle for Cu Pillar bump probing, Appli...
more info
Description:50 to 1000μm (25um step) Pitch Probe Card DC to 10 GHz
Pitch:
50 to 1000µm (25um step) (Recommended maximum GS (...
Frequency:
DC to 40 GHz
Configuration:
GS, GSG, GSSG, GSGSG
Body Material:
Aluminum Alloy
Contact Cycle:
Over 1M
Contact Pressure:
20 Gram
DC Voltage:
100 V
Connectors:
2.92 mm, 2.92 mm - Female
more info
Description:50 to 1250 microns Pitch Probe Card DC to 50 GHz
Pitch:
50 to 1250 microns
Frequency:
DC to 50 GHz
Configuration:
GS, GSG, SG
Body Material:
Beryllium Copper
Connectors:
2.4 mm - Female
more info
Description:RF Probe Card
Application:
WLCSP
Features:
Best suited to one-touchdown testing of 12-inch wa...
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Description:RF Probe Card
Features:
High-bandwidth RF microstrip transmission lines to...
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Description:RF Probe Card
Features:
Pogo pin Manufactured with MEMS Process, Customize...
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Description:50 to 1000μm (25um step) Pitch Probe Card DC to 10 GHz
Pitch:
50 to 1000µm (25um step) (Recommended maximum GS (...
Frequency:
DC to 67 GHz
Configuration:
GS, GSG, GSSG, GSGSG
Body Material:
Aluminum Alloy
Contact Cycle:
Over 1M
Contact Pressure:
20 Gram
DC Voltage:
100 V
Connectors:
1.85 mm, 1.85 mm - Female
more info

What is Probe Card?

A probe card is used in wafer testing for providing electrical contacts between the electronic test system & integrated circuits on the wafer. Wafer testing is a step and is performed during semiconductor device manufacturing. Usually, probe cards consist of a PCB (printed circuit board) with some form of electrical contact elements, usually metallic (non-metallic contacts also possible).

Probe cards act as electrical interfaces to provide an electrical path between the test system and the circuits on the wafer, during the wafer testing. By doing so, the probe card allows testing and validation of the integrated circuits (i.e., chips) at wafer-level, before they are diced and packaged.

Depending upon the shape and form of contact elements, probe cards can be classified as needle type, vertical type, and MEMS (Micro-Electro-Mechanical system).


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