RF PIN Diodes - Skyworks Solutions

43 RF PIN Diodes from Skyworks Solutions meet your specification.

RF PIN Diodes from Skyworks Solutions are listed on everything RF. We have compiled a list of RF PIN Diodes from the Skyworks Solutions website/catalog and made their products searchable by specification. Use the filters to narrow down on products based on your requirements. Download datasheets and request quotes for products that you find interesting. Your inquiry will be directed to Skyworks Solutions and their distributors in your region.

Selected Filters Reset All
  • Manufacturers: Skyworks Solutions
Description:Low Resistance, Low Capacitance, Plastic-Packaged PIN Diode
Configuration:
Single Diode
Frequency:
10 MHz to 10 GHz
No. of Diodes:
1
Forward Voltage:
0.85 V
Reverse Voltage:
50 V
Reverse Current:
10 uA
Capacitance:
0.23 to 0.30 pF
Power Dissipation:
250 mW
Package Type:
Surface Mount
more info
Description:Very Low Capacitance, Plastic Packaged Silicon PIN Diodes
Configuration:
Common Cathode, Single Diode
Frequency:
10 MHz to 6 GHz
No. of Diodes:
1, 2
Forward Voltage:
0.89 V
Reverse Voltage:
50 V
Reverse Current:
10 uA
Capacitance:
0.18 to 0.20 pF
Power Dissipation:
250 mW
Package Type:
Surface Mount
more info
Description:Very Low Capacitance, Plastic-Packaged Silicon PIN Diode
Configuration:
Single Diode
Frequency:
10 MHz to 6 GHz
No. of Diodes:
1
Forward Voltage:
0.89 V
Reverse Voltage:
50 V
Reverse Current:
10 uA
Capacitance:
0.18 to 0.20 pF
Power Dissipation:
250 mW
Package Type:
Surface Mount
more info
Description:Silicon PIN Diode Bondable Chips Silicon PIN Diode Bondable Chips Devices with 200 mA of forward current
Configuration:
Single Diode
Frequency:
100 MHz to 30 GHz
No. of Diodes:
1
Forward Current:
200 mA
Reverse Voltage:
50 V
Reverse Current:
10 uA
Capacitance:
0.1 to 0.20 pF
Package Type:
Chip
more info
Description:Silicon PIN Diode Bondable Chips Silicon PIN Diode Bondable Chips Devices with 200 mA of forward current
Configuration:
Single Diode
Frequency:
100 MHz to 30 GHz
No. of Diodes:
1
Forward Current:
200 mA
Reverse Voltage:
50 V
Reverse Current:
10 uA
Capacitance:
0.05 to 0.1 pF
Package Type:
Chip
more info
Description:Low Resistance, Plastic Packaged PIN Diodes
Configuration:
In Series, Single Diode
Frequency:
10 MHz to 6 GHz
No. of Diodes:
1, 2
Forward Voltage:
0.85 V
Reverse Voltage:
50 V
Reverse Current:
10 uA
Capacitance:
1 pF
Power Dissipation:
430 mW
Package Type:
Surface Mount
more info
Description:Low Capacitance, Plastic Packaged PIN Diodes
Configuration:
Common Cathode, Common Anode, Single Diode
Frequency:
10 MHz to 10 GHz
No. of Diodes:
1, 2
Forward Voltage:
0.8 V
Reverse Voltage:
200 V
Reverse Current:
10 uA
Capacitance:
0.18 to 0.35 pF
Power Dissipation:
250 mW
Package Type:
Surface Mount
more info
Description:Low Distortion Attenuator Plastic Packaged PIN Diode
Configuration:
Single Diode
Frequency:
5 MHz to 2 GHz
No. of Diodes:
1
Forward Voltage:
0.8 V
Reverse Voltage:
200 V
Reverse Current:
10 uA
Capacitance:
0.3 pF
Power Dissipation:
250 mW
Package Type:
Surface Mount
more info
Description:Silicon PIN Diode Bondable Chips Silicon PIN Diode Bondable Chips Devices with 200 mA of forward current
Configuration:
Single Diode
Frequency:
100 MHz to 30 GHz
No. of Diodes:
1
Forward Current:
200 mA
Reverse Voltage:
100 V
Reverse Current:
10 uA
Capacitance:
0.05 to 0.1 pF
Package Type:
Chip
more info
Description:Surface Mount PIN Diode with 200 mA of forward current
Configuration:
Single Diode
No. of Diodes:
1
Forward Voltage:
0.8 V
Forward Current:
200 mA
Reverse Voltage:
20 V
Reverse Current:
10 uA
Capacitance:
0.2 to 0.3 pF
Power Dissipation:
1000 mW
Package Type:
Surface Mount
more info

Filters

Configuration

Frequency

 
 
Apply

Package Type

Forward Voltage (V)

Apply

Reverse Voltage (V)

Apply

Forward Current (mA)

Apply

No. of Diodes