The Design and Evaluation of a Plastic Packaged Single-Chip FEM for 28 GHz 5G

Liam Devlin from Plextek RFI describes the design, realization and evaluation of an FEM MMIC for the 28 GHz 5G band. The part was developed by Plextek RFI and designed on WIN Semiconductors’ PE-15 0.15 µm, enhancement mode GaAs PHEMT process. It is realised in a compact, low-cost 5 mm x 5 mm plastic overmolded SMT compatible QFN package making it suitable for high volume, low cost manufacture.