Fill one form and get quotes for cable assemblies from multiple manufacturers
This presentation covers the design approach taken that was able to achieve world-class, first-time, first-pass success of a very high performance integrated circuit (IC) chipset for next generation wireless communications. Designs include a Q-to-E band doubler and a K-to-E band quadrupler circuit with an E-band medium power amplifier operating over the full ETSI band.
Create an account on everything RF to get a range of benefits.
By creating an account with us you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
Login to everything RF to download datasheets, white papers and more content.
Fill the form to Download the Media Kit
Content submitted here will be sent to our editorial team who will review and consider it for publication on the website. you will be emailed if this content is published on everything RF.
Please click on the button in the email to get access to this section.
