Bonding Layer Material Selection for use in High Performance Multilayer Circuit Board Design: Thermoset and Thermoplastic Options

  • Date: ┬áJuly 14, 2015
  • Event Time: 8am PT/ 11am ET/ 3pm UTC

Webinar Overview

Determining which bonding layer material to use in a high reliability multilayer circuit design can be a challenging task. Electrical and mechanical compatibility with a given base material requires consideration of a number of key properties that contribute to overall performance and reliability. Controlled impedance in a stripline construction is a fundamental consideration of multilayer board design; dielectric constant, thickness and spacing are also critical attributes. The choice between using thermoplastic films or thermosetting prepregs is generally based on compatibility and performance requirements related to the base dielectric material. However, complicating the electrical selection process are mechanical trade-offs and fabrication techniques that can affect the finished board’s mechanical reliability. In this seminar, we will discuss bonding layer material properties commonly used in high frequency/high reliability applications and how the material selection and fabrication process affect the electrical and mechanical performance of the finished board.

• Define thermoplastic
• Define thermoset
• Electrical properties
• Mechanical properties
• Reinforced and non-reinforced systems
• Board design considerations
• Lamination parameters
• Reliability