New Thermoset Polymer PCB Materials Raise the Bar for Automotive Radar Applications

  • Date: ┬áJuly 21, 2015
  • Event Time: 8am PT/ 11am ET/ 3pm UTC

Webinar Overview

This webinar explains how the stringent requirements for PCBs used in automotive radar can be met with high performance thermoset polymer systems. These requirements include:

  • Compatibility with both RF and high speed digital performance for single system-on-chip solutions
  • Predictable dimensional stability
  • Low loss, controlled dielectric constant
  • Lead-free construction
  • Tight-pitch packaging
  • Conductive anodic filament (CAF) resistance

The webinar will review the characteristics of PTFE-based materials, highly filled hydrocarbon based materials and new thermoset polymers. A case study will illustrate how high performance thermoset PCB materials can replace PTFE-based materials to achieve better performance and reliability.

Presenter Bio: 
Mike Miller is the senior manager for military and aerospace and a microwave design specialist for the OEM marketing team at Isola Group. He has more than 25 years experience in RF/microwave and electromagnetics, having held senior engineering positions at General Atomics, ANSYS, Boeing, Northrop Grumman and Lockheed-Martin. His career has focused on antenna and radome design; engineered EM material design, simulation and applications; and RF subsystems and channels. Mike has specialized in the application of computational electromagnetic tools. He holds an MSEE degree from Arizona State University and has co-authored seven patents in antennas and electromagnetically tailored materials. He is an active participant in the Electromagnetic Code Consortium and a member of NDIA and IEEE.

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