An Overview of Glass-Weave Impact on Millimeter-Wave PCB Performance

  • Webinar Date

    October 9, 2018

  • Webinar Time

    8am PT / 11am ET

Webinar Overview

Concerns for glass-weave effect having negative influences on circuitry have been considered for many years. In some cases there have been lively debates as to whether this effect was real or was fear mongering to support newly developed glass fabrics formulated to minimize the glass weave effect. Historically, it was the high speed digital industry that embraced several studies related to the glass weave and the RF industry initially did not pay a lot of attention to the potential effect. That was probably due to the fact the majority of RF applications were at microwave frequencies and the wavelengths were not really affected by the glass fabric geometries. However, over the past several years, there have been a lot of new RF applications at millimeter-wave frequencies, where the small wavelengths could potentially be affected by the glass weave patterns.

This webinar will be a practical approach to the glass weave effect and specifically in regards to its potential impact on millimeter-wave performance.

The following topics will be covered:

Basic overview of different glass styles and laminate constructions
Several potential circuit-glass configurations where glass weave patterns can impact RF performance differently
Other laminate influences that can be mistaken for glass weave effects
Overview of recent studies evaluating glass weave effects at millimeter-wave frequencies
Presenter Bio:

John Coonrod is the Technical Marketing Manager for Rogers Corporation’s, Advanced Connectivity Solutions. John has 30 years of experience in the Printed Circuit Board industry. About half of this time was spent in the Flexible Printed Circuit Board industry regarding circuit design, applications, processing and materials engineering. The past fifteen years have been spent supporting High Frequency Circuit materials involving circuit fabrication, providing application support and conducting electrical characterization studies. John is the Chair for the IPC D24C High Frequency Test Methods Task Group and holds a Bachelor of Science, Electrical Engineering degree from Arizona State University.