Enabling the Next Wave of RF-Connected Things With Differentiated Silicon
Wednesday, August 21, 2019
11:00 AM Eastern Daylight Time
Every thing is now connected. From Smart Cities to Smart Homes, all these connected things depend on wireless connectivity, with 5G, NB-IoT and BTLE advances now driving even more pervasive deployment of this next wave of linked devices.
There are conflicting constraints on silicon designs for these applications. The silicon must deliver the lowest power and the highest possible Quality of Service (RF connectivity), while empowering designers with the ability to minimize both cost and area.
Learn more about the semiconductor offerings targeted for NB-IoT in this evolving Internet of Things , the development challenges confronting chip designers for these applications, and the technology differentiators, such as MRAM and RF-optimized silicon-on-insulator, that are helping solution providers unlock opportunities in this rapidly growing segment.