Understanding Substrate Integrated Waveguide (SIW) Circuit Structures at Millimeter-Wave Frequencies

  • Webinar Date

    October 29, 2019

  • Webinar Time

    8am PT / 11am ET

Webinar Overview

When designing for a PCB-based millimeter-wave (mmWave) application, it is common to consider many different RF design-performance interactions. Over the past several years, many mmWave applications have used microstrip and Grounded Coplanar Waveguide (GCPW) structures. These structures have proven to be effective, however, when a designer considers the details of RF performance and performance variations for these structures, there are many pros and cons for each structure.

There is an RF circuit structure which has been considered in PCB-based mmWave applications that is somewhat different from standard structures, such as microstrip and GCPW. The Substrate Integrated Waveguide (SIW) is an RF structure which has many potential benefits for mmWave applications, however, implementing this structure at mmWave frequencies can be challenging. Some of the challenges for SIW implementation in PCB form at mmWave frequencies will probably be anticipated by the seasoned RF engineer, however, other issues may be less obvious. Some of the less obvious potential issues for SIW design at mmWave frequencies may be related to material properties and some may be related to normal PCB fabrication variations.

This webinar will give a summary of several studies conducted on different SIW structures at mmWave frequencies using various high frequency circuit materials. Here is the agenda:

  • Overview of mmWave SIW technology
  • Transitions to SIW
  • PCB fabrication concerns for mmWave SIW
  • Different SIW structures and their performance

Presenter Bio:
John Coonrod is the Technical Marketing Manager for Rogers Corporation’s Advanced Connectivity Solutions. John has 32 years of experience in the Printed Circuit Board industry. About half of this time was spent in the Flexible Printed Circuit Board industry regarding circuit design, applications, processing and materials engineering. The past eighteen years have been spent supporting High Frequency Circuit materials involving circuit fabrication, providing application support and conducting electrical characterization studies. John is the Chair for the IPC D24C High Frequency Test Methods Task Group and holds a Bachelor of Science, Electrical Engineering degree from Arizona State University.