Passive Intermodulation (PIM) in Printed Circuit Boards: Mechanisms and Mitigation

  • Webinar Date

    November 19, 2015

  • Webinar Time

    8am PT/ 11am ET/ 4pm UTC

Webinar Overview

Webinar Description:
Passive intermodulation (PIM) is a nonlinear effect that occurs in passive components and results in increased noise levels in communication systems. The increase in noise is due to the generation of parasitic signals within the desired receiver bandwidth. In cellular communications systems, this results in reduced coverage and data rates and dropped calls. While there are many sources of PIM, including contamination of connectors and the presence of ferromagnetic materials in the signal path, there has been heightened interest in PIM effects in PCBs. In PCBs, sources of PIM lie within the micro-features of the copper and resin systems. A fundamental understanding of PIM mechanisms and the proper selection of materials for mitigation are key to maximizing performance.

During this webinar, you will learn about:

  • the physical mechanisms of PIM in communication systems
  • the sources of PIM in PCBs and techniques for mitigation, including characteristics of copper traces, dielectric cores and PCB processing affecting PIM performance
  • PIMs impact on modern cellular performance
  • methods for measuring PIM in PCBs and associated challenges
  • the fundamental features necessary to achieve good PIM performance in PCBs

Mike Miller is the senior manager for military and aerospace and a microwave design specialist for the OEM marketing team at Isola Group. He has more than 25 years experience in RF/microwave and electromagnetics, having held senior engineering positions at General Atomics, ANSYS, Boeing, Northrop Grumman and Lockheed-Martin. His career has focused on antenna and radome design; engineered EM material design, simulation and applications; and RF subsystems and channels. Mike has specialized in the application of computational electromagnetic tools. He holds an MSEE degree from Arizona State University and has co-authored seven patents in antennas and electromagnetically tailored materials. He is an active participant in the Electromagnetic Code Consortium and a member of NDIA and IEEE.