Digital Signal Integrity, Circuit Board Design and the Interconnect Interface

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  • Author: Dale Reed
The objective of this article is to share valuable truths learned over the course of a career watching and working with design engineers as they deal with signal transport issues in real world situa-tions. Without using cal-culus or detailed technical charts, our objec-tive is to understand and offer clarity on the reasons why high frequency board level fabri-cation and packaging is not “business as usual” for high-speed digital signals, and why getting the signal on and off the board has our interest.
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