Company Offers Complete Packaging Solution for High Speed Circuits

StratEdge now offers a complete high performance micro-electronic packaging and testing solution. The com-pany designs and manu-factures ceramic and glasswall packages for devices operating from DC to 50+ GHz, performs complete assembly, marks the product, trims and forms the leads as required, then fully tests the device before shipment. Typical applications for the devices include microwave, high speed digital and mixed-signal products for networking, wire-less infrastructure, VSAT terminals, fiber optic communications (OC-48, OC-192, OC-768), test and measurement, military and aerospace
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