RF SiP Design Verification Flow with Quadruple LO Down Converter SiP
HeeSoo Lee and Dean Nicholson
The wireless indus-try trend toward higher integration and RF component miniaturization has been driving ongoing technolo-gy innovations, especially for substrate, intercon-nect, and packaging technologies. RF System-in-Package (RF SiP) is one of those leading technology innovations. RF SiP is usually a sub-system unit, and it typically consists of multiple dies with or without passive compo-nents generally constructed from embedded passives (EP) and SMT technology. However some passive circuits can also be constructed from integrated passive device (IPD) technolo-gy, especially when space requirements are tight or a higherQ is needed.
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