EM Insights Series - BGA Package Simulation

A Ball Grid Array (BGA) package is a very popular package style for high speed digital applications due to high density, low thermal resistance, and low inductance leads. However as the operating frequency and data rate go up, it is critically important for IC designers to understand the package’s electrical performance because of the parasitics that can come from the package. This episode demonstrates fast and accurate analysis of BGA packages with Momentum to get the desired package performance right the first time.
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