EM Insights Series - QFN Package
IC design is not finished until it is packaged. What is the upper frequency limit that the package can operate? Is it possible to use a lower cost package type to lower the final product cost? What about the performance of package isolation? As an example, LO to RF leakage performance of an up- or down-converter IC depends not only on the IC’s isolation performance but also on the package. In this episode, a 3x3[mm],16-pin Quad Flat No Leads (QFN) package is optimized to improve the frequency performance using FEM Simulator G2.
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