EM Insights Series - Solder/Wafer Bumps for Flip Chip, CPS, and WLP Applications

The popularity of solder/wafer bumps brings a new set of design challenges that require 3D full wave EM tools. This episode demonstrated how an ADS parameterized 3D component design kit enables designers to quickly draw 3D components such as solder bumps and co-design/optimize them with other schematic components. This integrated 3D EM design flow saves cycle time and increases first pass design success.