RF-SOI Wafer Characterization

While new network standards such as LTE Advanced require RF devices in the front-end module to perform with higher linearity, they increase the burden at all levels of the value chain to provide better RF products: from system design and RF integrated circuits down to engineered substrate design.

This paper describes how Soitec's innovative metrology on its wafers is able to predict the RF performance of final devices manufactured on Soitec RFeSITM substrates.