Optimized Placement of Microwave Absorbers on High Speed Digital Channels with SI, EMI and RFI Considerations

Download Whitepaper
  • Author: Mohammad Ali Khorrami

In this paper, the placement of microwave absorbers on the outer layers of multi-layer printed circuits boards (PCBs) with several high speed channels, to mitigate electromagnetic radiations from noisy transmission lines is investigated. New techniques to decrease the electromagnetic emissions from noisy digital circuitries are essential specifically in mobile devices that incorporate sensitive wireless radio receivers and noisy data buses in the proximity. Here, empirical results are presented to characterize the reduction of electromagnetic radiations from the PCB as the absorbers are applied while considering undesired consequences leading to the eye closure of the high speed channel.