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Many products are designed with today’s high-performance Integrated Circuits (IC). Without IC sockets, the design, testing, and/or production phases of a new product development process will be chaotic. In response to these demanding needs, sockets featuring a wide variety of contacting methods, form factors, and mounting techniques were developed. High-performance applications require the smallest possible socket form factor to place related components in close proximity to the device pads. As devices with finer pitch, larger I/O counts, and increased gate densities are utilized, the requirements for sockets continue to increase accordingly. These place extreme demand on shortened contact lengths and to integrate controlled impedance geometries into the contact.
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