Plating Showerhead System for Improved Backside Wafer Plating
Jens Riege, Heather Knoedler, Shiban Tiku, and Nercy Ebrahimi
Plating thickness uniformity can become increasingly difficult to control when migrating from four inch to six inch wafers, especially when plating through-wafer vias with non-cyanide gold bath solution. The standard tooling provided on our four inch plating equipment did not scale adequately for the larger wafer size and still maintain good process control. The solution implemented at Skyworks changes the plating solution delivery to the wafer surface to provide better process control and better plating uniformity. This process qualification was part of a Six Sigma team effort to help ensure timely project success.
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