The continuous demand for higher data rate is pushing the frequency boundary and performance level of RF components used in a test setup. For design validation testing (DVT), test components including RF test assemblies and RF board connectors, must be “electrically transparent” to ensure a reliable characterization of the device under test (DUT). While low frequency / low data rate applications can forgive the use of a generic footprint for RF board connectors, today’s bandwidth to support data rate of 56 Gbps and beyond requires an optimized footprint designed and matched to a specific board stackup to ensure best performance in the desired frequency range.

Design cycles are getting shorter to respond to the faster pace of innovation of the markets (semiconductor, 5G, automotive and more) and it is tempting to create a symbol in the design library with a default layout. However consequences on performance can be significant often requiring a new design loop which is time consuming and expensive.