GaAs and GaN Die Assembly and Handling Procedures

This White Paper outlines methods for proper handling, component placement, optimum attachment methods, and interconnect techniques for use with GaN and GaAs microwave monolithic integrated circuits (MMICs) in electronic assemblies.

Note  that  GaAs  and  GaN  MMICs  are  sensitive  to  electrostatic  discharge  (ESD).  Precautions  should  be  taken  with properly  grounding  equipment,  environment,  workstations,  and  operators  to  minimize/eliminate  ESD  during  die handling,  assembling,  and  packaging.  Operators  should  wear  proper  ESD  grounding  straps.  Test  and  assembly equipment and stations should be properly grounded and periodically tested for ESD compliance.

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