IMS 2013 MicroApps - Integrated Electro-Thermal Design of a SiGe PA

  • Author: Dr. Mike Heimlich and Mark Saffian

This presentation shows how the inclusion of thermal simulation in RF/microwave design flow is now possible with modern thermal solvers linked into RF/microwave design tools. SiGe HBT PA design is used as an example, where such a flow is most beneficial due to numerous issues such as array sizing and thermal runaway.