Surface Mount Thermal Conductors for Heat Management

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  • Author: Jern Ng

Efforts to miniaturize electronics are becoming increasingly common as designers work to fit more components into smaller packages, offering low-weight, low-volume products. The continuous march toward electronic miniaturization brings to light one primary challenge: the dissipation of heat. As semiconductor manufacturing realizes smaller feature sizes, microprocessor capability is simultaneously advancing with greater functionality. The result is increased energy density and unprecedented challenges with moving heat from the core of an IC to the ambient environment. From the end-user perspective, heat management is critically important.

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