RF Component Integration – Saving Space in High Performance Applications
Ashraf Elghamrawi and Eamon Nash
A higher level of RF component integration is a trend which is visible across the semiconductor industry. However, the level of integration that has been achieved varies significantly by application, with a tendency to have less integration in applications where higher performance is required. This article will look at the kinds of signal chains and applications that have tended to use discrete high performance RFICs. By looking at recent advancements in component integration we will identify those areas where significant opportunities exist to make circuits smaller, while still maintaining a high level of performance.
By downloading a white paper, the details of your profile might be shared with the creator of the content and you may be contacted by them directly.