Soitec, a world leader in the design and production of innovative semiconductor materials has earned recognition from UMC, a leading global semiconductor foundry company, for its unrelenting focus on further improving the quality and performance of its RF-SOI wafers and was awarded UMC’s “Outstanding Supplier” award in Hsinchu, Taiwan.
The award was conferred on Soitec as the company was adjudged to have exceeded UMC’s exacting requirements for product performance, volume support, and excellent technical and customer support. Over 1,000 companies that provide materials and services to UMC were assessed for the annual award.
Since 2013, Soitec has forged a long-term relationship with UMC by supplying the latter’s foundries in Singapore and Taiwan with high-end 200 mm and 300 mm engineered wafers which are turned into microchips for mobile phone and communications industries.
“We are very honored to be given this award by UMC because it is a resounding validation of our continuous efforts to further improve the quality and performance of our wafers and always stay ahead of the curve. Soitec is in a pole position to drive innovation in semiconductor technology, leverage its unique know-how and respond to the growing demand and need for ever more differentiated and value-adding solutions.,” said Bernard Aspar, Chief Operating Officer of Soitec. “The award adds another chapter to strengthen our long-standing relationship with UMC. As both companies share a common purpose of creating a sustainable future, Soitec will work closely with UMC to explore innovative ways of using our energy-efficient engineered wafers to power smartphones and smart devices of today and tomorrow. Our collaboration with UMC is a perfect example of our intimacy with customers and the entire ecosystems and underlines our long-haul approach to breed innovation and deploy integrated go-to-market growth strategies.”