RF & Microwave Laminates

222 Laminates from 9 manufacturers listed on everything RF

Laminates are materials used as insulating substrates for PCB boards or boards on which circuits are printed or designed. Laminates from the leading manufacturers are listed below. Use the filters to narrow down on products based on your requirement. Download Datasheets, Compare products and Request Quotations. Your Inquiry will be directed to the manufacturer and their distributors who will get back to you with a quote.

Description:Thermally Stable Composite based on Nanotechnology and PTFE
Dk (Dielectric Constant):
2.80
Df (Dissipation Factor):
0.0012
Thickness:
0.13 mm
more info
Description:Flame-Retardant Glass Reinforced Hydrocarbon Laminates
Dk (Dielectric Constant):
4.38
Df (Dissipation Factor):
0.005
Tg:
280 Degrees C
Td:
414 Degrees C
Thickness:
0.508 to 3.048 mm
more info
Description:Ultra Low Loss Laminate and Prepreg Operates up to 25 GHz
Dk (Dielectric Constant):
3.5
Df (Dissipation Factor):
0.0020 to 0.0028
Tg:
200 Degrees C
Td:
390 Degrees C
more info
Description:Halogen-Free Extremely Low Loss Material for Next-Gen 5G Infrastructure
Dk (Dielectric Constant):
3.10
Df (Dissipation Factor):
0.0015
Tg:
200 Degrees C
Td:
380 Degrees C
more info
Description:Laminate with Dielectric Thickness of 2.6
Dk (Dielectric Constant):
2.6
Tg:
220 Degree C
Thickness:
0.038 to 0.086 mm
more info
Description:Ultra Low Loss PTFE Woven Glass Laminate
Dk (Dielectric Constant):
2.2
Df (Dissipation Factor):
0.0009
Thickness:
0.254 to 1.524 mm
more info
Description:4.4 (Dk), 173 Degrees (Tg), RF Laminate Up to 1 GHz
Dk (Dielectric Constant):
4.4
Df (Dissipation Factor):
0.016
Tg:
173 Degrees
more info
Description:High DK, low loss glass-reinforced prepreg
Dk (Dielectric Constant):
8
Df (Dissipation Factor):
0.0034
more info
Description:High Stability Thermoset RF Laminates for Industrial Radar Applications
Dk (Dielectric Constant):
3.49
Df (Dissipation Factor):
0.0031 to 0.0037
Tg:
280 Degrees C
Td:
290 Degrees C
Thickness:
0.004”
more info
Description:Copper-Clad Laminate for RF Applications
Dk (Dielectric Constant):
3.5
Df (Dissipation Factor):
0.0032 to 0.0038
Tg:
170 to 200 Degrees C
more info

What are RF & Microwave Laminates?

A Laminate is a material used as the substrate of a PCB board or board on which the circuit is printed or created. It is an insulating layer made up of woven, fabric, fiberglass or paper which are then fixed together to form a single sheet of uniform thickness by applying adequate pressure and temperature with the help of a resin. The laminate can be seen on the edges of a PCB board since it’s covered with Conductive Copper, Solder mask, and Silkscreen layers.

RF & Microwave Laminate are designed to perform at higher frequencies. When selecting a laminate we must consider the following parameters:

Dissipation Factor (Df): This is a measure of loss of energy in the laminated. The lower the  Dissipation Factor the lower the signal loss and the better the laminate.

Dielectric Constant (Dk): This is the ratio of the permittivity of a substance to the permittivity of free space. It is a dimensionless value and is also called relative permittivity.

Transition Temperature (Tg): This is the maximum temperature at which the laminate can operate. i.e it is the temperature at which the laminate transitions from a usable material to a non-usable material.

Thickness: This is the thickness of the laminate material.

everything RF has listed high-frequency laminate materials from the leading manufacturers. Narrow down on the list of laminate materials based on their properties. View laminate specifications, download datasheets and request quotations or information on products that meet your requirement.

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