DuPont Microcircuit and Component Materials (MCM) is collaborating with the Industrial Technology Research Institute (ITRI) of Taiwan to demonstrate the value of DuPont™ GreenTape™ LTCC (Low-Temperature Co-fired Ceramics) material used in AiP (Antenna in Package) applications. This collaboration is resulting in an ideal alternative to existing Print Circuit Board (PCB) options.
In 5G communication, millimeter wave (mmWave) radio frequencies are used to achieve ultra-high-speed, large capacity, and ultra-low latency. GreenTape™ LTCC and Argentum conductive pastes are used to form radio frequency components, substrates, and Antenna in Package for Radio Frequency Front End Modules in 5G mmWave small cells/peripherals. The LTCC system offers advantages of higher reliability, excellent electrical performance, good thermal conductivity, and outstanding environmental resistance, which enables a higher degree of design freedom.
“We’re honored to collaborate with ITRI to demonstrate the value of DuPontTM MCM GreenTapeTM LTCC systems for Antenna in Package applications. To achieve better efficiency and lower power consumption in the antenna array and Radio Frequency Front End Module, RF circuit design and low loss material with good thermal stability & reliability will be the critical success factors. ITRI has very strong capabilities which include circuit design, LTCC prototyping, system assembly and testing, and RF performance validation. This collaboration successfully showcases DuPontTM MCM GreenTapeTM LTCC as a perfect material system for Antenna in Package applications,” said Yu-Ling Hsiao, global technology leader, DuPont MCM.
“LTCC delivers both superior environmental tolerance and a high level of design freedom in high-frequency applications. It is perfectly suited for use in RF transceiver devices at 5G mmWave band, such as 28 GHz and 39 GHz,” said Tzong-Ming Lee, ITRI vice president, and general director of Material and Chemical Research Laboratories. “Using single material DuPont™ MCM LTCC GreenTape™, we can maintain good thermal stability and heat performance while significantly reducing insertion loss. This has opened the door to developing new AiP substrates, reducing size and signal loss.”
In July, DuPont MCM will hold a joint seminar with ITRI of Taiwan in Taipei to introduce the latest prototype to the market.
An in-depth introductory video of the technology was officially launched at the Del Mar Electronics & Manufacturing Show (DMEMS) 2022 which took place on 5 May, 2022.