ED2 Corporation, a company that designs a range of products in electronics and wireless communications, has developed Advanced Glass Packaging Technology (AGPT™) that will enable heterogeneous integration of electronic components and modules. The AGPT technology is based on using Synthetic Quartz (Fused Silica) as the substrate material that exhibits excellent thermal, electrical, and optical properties. It enables ultra-small feature sizes, excellent high frequency response, allowing for tight integration and supporting fabrication as a wafer-level process, for scale and cost.
The heterogeneous integration of components is facilitated by System in Packages (SiP) that offer higher levels of functionality at the semiconductor level, leading to smaller footprint modules by integrating different functionalities into a single chip. As a result, the SiPs are very useful to save significant costs and drives advanced semiconductor technologies in various applications.
Benefits of Fused Silica in Heterogeneous Semiconductor Packaging
Fused silica, sometimes referred to as fused quartz, is a type of glass that is made from silicon dioxide (SiO2). It is known for its high purity, low thermal expansion, and excellent thermal shock resistance. Fused silica can offer several benefits when used in heterogeneous semiconductor packaging:
High purity: Fused silica is made from high-purity silicon dioxide, which makes it an ideal material for use in semiconductor packaging because it can reduce contamination and improve device performance.
Low coefficient of thermal expansion: Fused silica has a low coefficient of thermal expansion, which means it does not deform or distort when exposed to temperature changes. This property can be beneficial in semiconductor packaging because it helps to maintain the integrity of the package and the devices within it, even when exposed to extreme temperatures.
Excellent thermal shock resistance: Fused silica has excellent thermal shock resistance, which means it can withstand rapid temperature changes without cracking or breaking. This makes it suitable for use in semiconductor packaging that may be subjected to temperature cycling during use.
High strength: Fused silica is a strong and durable material, which can be beneficial in semiconductor packaging because it can help to protect the devices within the package and improve the overall reliability of the package.
Chemical resistance: Fused silica is resistant to most chemicals, which can be useful in semiconductor packaging because it can help to protect the devices within the package from exposure to chemicals during manufacturing and use.
Synthetic Fused Silica is Perfect for mmWave to THz Applications
Having known for Fused Silica’s high purity, low thermal expansion, and excellent thermal shock resistance, all of these make it an ideal material for a wide range of applications, including:
Optics: Fused silica is used to make lenses, prisms, and other optical components because it has a very low refractive index and does not absorb UV light.
Semiconductor manufacturing: Fused silica is used to make components for the semiconductor industry because it is resistant to high temperatures and has a low coefficient of thermal expansion, which means it does not deform when heated.
Aerospace: Fused silica is used in the aerospace industry to make components that need to withstand extreme temperatures and high pressure, such as rocket nozzles and engine parts.
Chemical processing: Fused silica is resistant to most chemicals, making it useful in chemical processing and storage applications.
Medical: Fused silica is used to make medical equipment and devices, such as test tubes and pipettes, because it is chemically resistant and easy to sterilize.
Construction: Fused silica is used in construction because it is strong and durable, making it suitable for use in building materials, such as floor tiles and countertops.
ED2's Focus is on Developing Smaller Footprint Modules Based on AGPT™
ED2 Corporation, based in Tucson, Arizona, is comprised of a core group of scientists and Engineers with a long history in solving engineering, technology and RF challenges in a variety of contexts. As the commercial cellular industry moves to higher frequencies in search of more spectrum, the team’s capability is a perfect fit for the industry.
The technical team has a long history in semiconductor packaging and is working to advance the category with fused silica, promoting a set of innovations grouped under the term “Advanced Glass Packaging Technology™ (AGPT).”
AGPT offers a number of advantages as a substrate for semiconductor packaging and for the creation of high-frequency RF devices. When engaged in the project of developing a device using fused silica, it is important to understand all of the operations involved, and best practices around ensuring a successful implementation.
Click here to learn more about ED2's Advanced Glass Packaging Technology (AGPT).
