IMS 2013 MicroApps - Optimizing Chip-Module-Board Transitions Using Integrated EM and

This presentation highlights how the new features in AWR's Analyst™ 3D FEM EM solver can be used to optimize a chip-module-board transition. The transition discussed is typical of a high-speed analog signal line, going from a high performance system board, onto a BGA mounted module, through the module, and onto an RFIC chip by means of bond wires.