Designing Interconnects with Complete Technology

As digital speeds increase, connectors and interconnects have become more challenging to design. In addition to this, the design requirements themselves are becoming broader in scope. This eSeminar will show how “Complete Technology” can leverage a diverse and powerful set of solvers and feature workflows to meet these challenges. Selecting the best solver for a certain application, or a certain part of the design specification, can make all the difference to simulation time spent. The Complete Technology license is deep and broad, assisting outside of the electromagnetic realm into thermal and power integrity applications.

Presenter bio:
Tracey Vincent is a Senior Application Engineer with CST, part of the SIMULIA brand of Dassault Systèmes. She has a combined Bachelors/Masters Degree in Electrical and Electronic Engineering from Herriot-Watt University in Edinburgh, Scotland and a Masters degree from Napier University, Scotland, UK, where she wrote an FEA program to solve fields in ferrimagnetic materials. Vincent has ten years experience as a design engineer. She completed her Ph.D. at WPI in Worcester, MA, in 2009, where she investigated the effect of material topography on RF signal loss.