FG360-NA

Cellular Module by Fibocom (78 more products)

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FG360-NA Image

The FG360-NA from Fibocom is a Sub-6 GHz 5G Module that is designed for North America. It supports both 5G SA and NSA network architectures with faster transmission speed, better carrying capacity, and lower network latency. The module is based on the MediaTek T750 SoC with a downlink data rate of up to 4.13 Gbps and an uplink data rate of 1.25 Gbps. It supports 2CC Carrier Aggregation up to 200 MHz to improve the utilization of spectrum resources and ensure extended 5G coverage. The module is compatible with LTE and WCDMA standards which helps to reduce investment complexity in the initial stage of 5G construction.

The FG360-NA has multiple interfaces that include USB 3.1/3.0/2.0, PCIe 3.0, GPIO, etc. It is available in a module with an LGA form factor that measures 41.00 x 44.00 x 2.75 mm and is suitable for use in the gateway, industrial monitoring, remote medical treatment, UAV, virtual reality, and immersive experience (VR and AR) applications.

Product Specifications

Product Details

  • Part Number
    FG360-NA
  • Manufacturer
    Fibocom
  • Description
    Sub-6 GHz 5G Module for North America

General Parameters

  • Region
    NAFTA
  • Carrier
    T-Mobile, AT&T, Verizon
  • 5G Bands
    n2, 5, 7, 12, 14**, 25, 30, 41, 66, 71, 77, 78
  • Fallback
    NA
  • GNSS Standard
    GPS, Glonass, BeiDou, Galileo, QZSS
  • AT Command
    Yes
  • LTE/4G Band
    B2, B4, B5, B7, B12, B13, B14, B17, B25, B26, B29, B30, B66, B71, B41, B48, B46
  • UMTS/HSPA/3G/WCDMA Band
    B2, B4, B5
  • IoT
    No
  • MIMO
    Yes
  • Certification
    FCC, IC, PTCRB, GCF
  • Drivers
    Linux 4.1
  • Package
    LGA
  • Form Factor
    LGA
  • Generation
    5G, 4G/LTE, 3G
  • Interface
    UART, GPIO, I2C, SDIO, I2S, USB 3.1, 3.0, 2.0, UIM, PCIe 3.0, 2.0, SPI, SRGMII
  • Data Rate
    150 Mbps to 4.13 Gbps
  • Datarate Download Link
    1.6 to 4.13 Gbps
  • Datarate Uplink
    150 Mbps to 1.1 Gbps
  • Integrated Features
    GNSS, Antenna
  • Voltage
    3.3 to 4.4 V
  • Size
    41 x 44 x 2.75 mm
  • Operating Temperature
    -30 to 75 Degree C
  • Storage Temperature
    -40 to 85 Degree C
  • Package Type
    Surface Mount
  • ROHS
    Yes
  • Processor
    MT T750
  • Sms
    Yes
  • Voice
    No