RF & Microwave Laminates - Ventec Electronics

12 Laminates from Ventec Electronics meet your specification.

Laminates from Ventec Electronics are listed on everything RF. We have compiled a list of Laminates from the Ventec Electronics website/catalog and made their products searchable by specification. Use the filters to narrow down on products based on your requirements. Download datasheets and request quotes for products that you find interesting. Your inquiry will be directed to Ventec Electronics and their distributors in your region.

Selected Filters Reset All
  • Manufacturers: Ventec Electronics
Description:10 W/m*K Copper Metal Base Laminate
Dk (Dielectric Constant):
5.5
Df (Dissipation Factor):
0.014
Tg:
180 Degree C
Td:
400 Degree C
Thickness:
0.004 Inch
more info
Description:3 W/m*K Copper Metal Base Laminate
Dk (Dielectric Constant):
4.8
Df (Dissipation Factor):
0.016
Tg:
130 Degree C
Td:
380 Degree C
Thickness:
0.002, 0.003, 0.004, 0.006, 0.007 Inches
more info
Description:4.2 W/m*K Copper Metal Base Laminate
Dk (Dielectric Constant):
4.8
Df (Dissipation Factor):
0.016
Tg:
120 Degree C
Td:
380 Degree C
Thickness:
0.002, 0.003, 0.004, 0.006, 0.008 Inches
more info
Description:7 W/m*K Aluminium Metal Base Laminate
Dk (Dielectric Constant):
4.8
Df (Dissipation Factor):
0.016
Tg:
100 Degree C
Td:
380 Degree C
Thickness:
0.6, 0.8, 1, 1.2, 1.5, 2, 3 mm
more info
Description:3.6 W/m*K Copper Metal Base Laminate
Dk (Dielectric Constant):
4.8
Df (Dissipation Factor):
0.016
Tg:
100 Degree C
Td:
380 Degree C
Thickness:
0.002, 0.004 Inches
more info
Description:4.2 W/m*K Aluminium Metal Base Laminate
Dk (Dielectric Constant):
4.8
Df (Dissipation Factor):
0.016
Tg:
120 Degree C
Td:
380 Degree C
Thickness:
0.6, 0.8, 1, 1.2, 1.5, 2, 3 mm
more info
Description:2.2 to 3.4 W/m*K Copper Thermally conductive Laminates & Prepreg
Tg:
90 to 130 Degree C
Td:
340 to 380 Degree C
Thickness:
0.003, 0.004, 0.006, 0.008 Inches
more info
Description:2.2 W/m*K Aluminium Thermally Conductive Laminate
Dk (Dielectric Constant):
5.1
Df (Dissipation Factor):
0.014
Tg:
130 Degree C
Td:
380 Degree C
Thickness:
0.6, 0.8, 1, 1.2, 1.5, 2, 3 mm
more info
Description:2.2 to 3.4 W/m*K Copper High Thermal Conductivity Laminates & Prepreg
Tg:
170 to 190 Degree C
Td:
340 to 375 Degree C
Thickness:
0.002, 0.003, 0.004, 0.006, 0.008, 0.012 Inches
more info
Description:7 W/m*K Copper Metal Base Laminate
Dk (Dielectric Constant):
4.8
Df (Dissipation Factor):
0.016
Tg:
100 Degree C
Td:
380 Degree C
Thickness:
0.003, 0.004, 0.006 Inches
more info

FiltersReset All

Dk (Dielectric Constant)

Apply

Df (Dissipation Factor)

Apply

Tg (Degrees C)

Apply

Td (Degrees C)

Apply

Thickness (mm)

Apply

Related Categories