Optimize Thermal Contact for RF Transistors
High Frequency Electronics, Semflex, Inc.
- Author:
John C. Pritiskutch and Richard R. Hildenbrandt
The case-to-heatsink interface is a sig-nificant contribu-tor to the overall thermal resistance from semicon-ductor junction to heatsink dissipation for transistors with low junc-tion-to-case thermal resistance. This contact thermal resistance is comprised of surface irregularities of the tran-sistor flange and heatsink, the interface medi-um, and contact pressure.
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