Novel Passivation Ledge Monitor in an InGaP HBT Process

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  • Author: Cristian Cismaru and Peter J. Zampardi

The HBT ledge thickness and quality is vital for device performance and reliability. In this work we report on a measurement technique and test structure for monitoring the emitter passivation ledge based on the use of TaN as a barrier between the InGaP ledge surface and the top metal contact. The technique is suitable for the manufacturing environment.

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