Passive SMT mounting techniques: Face-up Vs Face-down and Performance Trade-offs
International Manufacturing Services (IMS)
The choice of mounting orientation, termination styles, pad dimensions and sizes used for surface mount passive resistive components are some of the factors that contribute to the device’s performance in an RF circuit layout. Determining the trade off between these factors in addition to ease of component-to-PCB assembly, solderability, ruggedness and other design optimization for power and RF performance could be an onerous task for RF engineers. The purpose of this technical note is to shine light on the advantages and/or disadvantages of these mounting techniques and termination styles in high frequency applications.
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