Thermal Effects of Solder Reflow on RF PCB Connector Design

This paper explores the changes that different dielectric materials undergo during a standard PCB solder reflow process. The dielectrics examined are PTFE, Torlon, PEEK, Ultem, and Corning #7070 glass. The connectors used for the testing are all male SMP surface mount connectors. The connectors were soldered using Sn96 solder and tested electrically. Mating end dimensions were taken after reflow as well as measurements to determine how evenly the connectors were soldered to the board.

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