EDI CON USA is a new event that will be organized by Microwave Journal in September 2017. They also organize EDI CON China and the European Microwave Week. EDI CON USA will bring the high frequency electronic and high-speed digital design communities together to address the engineering and manufacturing issues that face today’s design engineers. Practical content will be presented in technical forums, workshops and panel sessions and targets engineers working in the communications, aerospace and defense sectors. Unlike most academic-driven conferences, the EDI CON exhibition and conference are synergistic, with industry experts presenting technical content and displaying the latest solutions in the exhibition.