EDI CON USA is a new event that will be organized by Microwave Journal in September 2017. They also organize EDI CON China and the European Microwave Week. EDI CON USA will bring the high frequency electronic and high-speed digital design communities together to address the engineering and manufacturing issues that face today’s design engineers. Practical content will be presented in technical forums, workshops and panel sessions and targets engineers working in the communications, aerospace and defense sectors. Unlike most academic-driven conferences, the EDI CON exhibition and conference are synergistic, with industry experts presenting technical content and displaying the latest solutions in the exhibition.
R&S Spectrum Analyzer Now Provides 5 GHz Signal Analysis Bandwidth
Sep 12, 2017
Smiths Interconnect Showcases High Power Microwave Transceivers and mm-wave Circulators at EDI-CON USA
MACOM to Exhibit RF and Microwave Portfolio at EDI CON USA
Sep 11, 2017
Paul Blount from Custom MMIC to Speak on Phase Noise Reduction Techniques at EDICON USA
Sep 08, 2017
National Instruments to Feature the NI AWR Design Environment Version 13 at EDI CON USA 2017
Sep 07, 2017
Rogers Corp to Exhibit Latest Circuit Materials & Design Insights at EDICON USA 2017
Sep 04, 2017
Indium Corporation Expert to Present at EDI CON USA 2017
Aug 18, 2017
EDI CON USA 2017 Announces Scholarship Program for University Students
Aug 09, 2017
EDI CON USA 2017 Announces Analog Devices as its Host Sponsor
SemiGen Purchases New Fabrication Facility to Boost Current Diode, Passive, and Thin Film Capabilities
Jul 24, 2017
EDI CON USA 2017 to Hold a European Radar Summit
Jun 23, 2017
EDI CON USA 2017 Announces Addition European Radar Summit
Jun 14, 2017
