I-Tera MT40 Image

I-Tera MT40

Laminate by Isola Group (46 more products)

Note : Your request will be directed to Isola Group.

The I-TERA MT40 from Isola Group is a Low-Loss Laminate Material, suitable for many high-speed digital and RF/microwave printed circuit designs. This material has a dielectric constant (Dk) of 3.38 to 3.75 which is stable between -40°C and 140°C up to W-band frequencies (75 to 110 GHz). This laminate material offers a very low dissipation factor (Df) of 0.0028 to 0.0035, making it a cost-effective alternative to PTFE and other commercial microwave and high-speed digital laminate materials. The I-TERA materials have a transition temperature (Tg) of 200 degrees Celsius. These RoHS-compliant laminates offer processing benefits like FR-4 process compatibility, dimensional stability, multiple reflow capability, and multiple lamination cycles.

The I-Tera MT40 laminate materials are currently being offered in both laminate and prepreg form in typical thicknesses (10, 20, 30, 60 mils) and standard panel sizes. They provide a complete material solution package for high-speed digital multilayer, hybrid, RF/microwave, multilayer, and double-sided printed circuit designs. These materials do not require any special through-hole treatments commonly needed when processing PTFE-based laminate materials. They have IPC-4103/17 and UL (E41625) industry approvals and are currently manufactured in North America and Europe. They are suitable for applications in aerospace & defense, automotive & transportation, medical, industrial & instrumentation, and RF/ microwave market.

Product Specifications

    Product Details

    • Part Number :
      I-Tera MT40
    • Manufacturer :
      Isola Group
    • Description :
      FR-4 Process Compatible Low-loss Laminate Material

    General Parameters

    • Dk (Dielectric Constant) :
      3.45
    • Df (Dissipation Factor) :
      0.0031
    • Td :
      360 Degrees C
    • Tg :
      200 Degrees C
    • Surface Resistivity :
      1.33 x 105MO
    • Volume Resistivity :
      1.33 x 7 MO-cm
    • Dielectric Breakdown :
      45.4 kW
    • Thermal Conductivity :
      12 ppm/ Degrees C

    Technical Documents

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