RF & Microwave Laminates

17 Laminates from 2 Manufacturers meet your specification.
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  • Manufacturers: W. L. Gore & Associates, Ventec Electronics
Description:Laminate with Dielectric Thickness of 3.3 to 3.4
Tg:
220 Degree C
Thickness:
0.063 mm
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Description:7 W/m*K Aluminium Metal Base Laminate
Dk (Dielectric Constant):
4.8
Df (Dissipation Factor):
0.016
Tg:
100 Degree C
Td:
380 Degree C
Thickness:
0.6, 0.8, 1, 1.2, 1.5, 2, 3 mm
more info
Description:Laminate with Dielectric Thickness of 2.6
Dk (Dielectric Constant):
2.6
Tg:
220 Degree C
Thickness:
0.038 to 0.086 mm
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Description:Laminate with Dielectric Thickness of 2.8
Dk (Dielectric Constant):
2.8
Tg:
155 Degree C
Thickness:
0.03 to 0.06 mm
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Description:4.2 W/m*K Copper Metal Base Laminate
Dk (Dielectric Constant):
4.8
Df (Dissipation Factor):
0.016
Tg:
180 Degree C
Td:
400 Degree C
Thickness:
0.002, 0.003, 0.004, 0.006, 0.008 Inches
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Description:Laminate with Dielectric Thickness of 2.6
Dk (Dielectric Constant):
2.6
Tg:
220 Degree C
Thickness:
0.057 to 0.086 mm
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Description:2.2 to 3.4 W/m*K Copper High Thermal Conductivity Laminates & Prepreg
Tg:
170 to 190 Degree C
Td:
340 to 375 Degree C
Thickness:
0.002, 0.003, 0.004, 0.006, 0.008, 0.012 Inches
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Description:Laminate with Dielectric Thickness of 2.7
Dk (Dielectric Constant):
2.7
Tg:
220 Degree C
Thickness:
0.057 to 0.086 mm
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Description:3.6 W/m*K Copper Metal Base Laminate
Dk (Dielectric Constant):
4.8
Df (Dissipation Factor):
0.016
Tg:
100 Degree C
Td:
380 Degree C
Thickness:
0.002, 0.004 Inches
more info
Description:2.2 to 3.4 W/m*K Copper Thermally conductive Laminates & Prepreg
Tg:
90 to 130 Degree C
Td:
340 to 380 Degree C
Thickness:
0.003, 0.004, 0.006, 0.008 Inches
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