RF & Microwave Laminates

55 Laminates from 2 Manufacturers meet your specification.
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  • Manufacturers: W. L. Gore & Associates, Isola Group
Description:Halogen-free, Very Low Loss Laminate for 5G Infra and Computing Applications
Dk (Dielectric Constant):
3.05
Df (Dissipation Factor):
0.0018
Tg:
210 Degrees C
Td:
400 Degrees C
more info
Description:Laminate with Dielectric Thickness of 3.3 to 3.4
Tg:
220 Degree C
Thickness:
0.063 mm
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Description:Halogen-free, Very Low Loss RF/Microwave Laminate
Dk (Dielectric Constant):
3.45
Df (Dissipation Factor):
0.0032
Tg:
200 Degrees C
Td:
390 Degrees C
more info
Description:Laminate with Dielectric Thickness of 2.6
Dk (Dielectric Constant):
2.6
Tg:
220 Degree C
Thickness:
0.038 to 0.086 mm
more info
Description:Low-Loss Laminate Material for RF & Microwave Applications
Dk (Dielectric Constant):
3.48
Df (Dissipation Factor):
0.0029
Tg:
200 Degrees C
Td:
360 Degrees C
Thickness:
1.5 mm
more info
Description:Laminate with Dielectric Thickness of 2.8
Dk (Dielectric Constant):
2.8
Tg:
155 Degree C
Thickness:
0.03 to 0.06 mm
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Description:Low-Loss Laminate Materials for Aerospace & Defense Applications
Dk (Dielectric Constant):
3 / 3.38 / 3.45 / 3.48
Df (Dissipation Factor):
0.0020 to 0.0029
Tg:
200 Degrees C
Td:
360 Degrees C
Thickness:
0.51, 0.76, 1.5 mm
more info
Description:Laminate with Dielectric Thickness of 2.6
Dk (Dielectric Constant):
2.6
Tg:
220 Degree C
Thickness:
0.057 to 0.086 mm
more info
Description:FR-4 Process Compatible Low-loss Laminate Material
Dk (Dielectric Constant):
3.45
Df (Dissipation Factor):
0.0031
Tg:
200 Degrees C
Td:
360 Degrees C
more info
Description:Laminate with Dielectric Thickness of 2.7
Dk (Dielectric Constant):
2.7
Tg:
220 Degree C
Thickness:
0.057 to 0.086 mm
more info

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