Careful thermal design coupled with innovative heat sink technologies have resulted in an industry benchmark in solidstate power amplifier technology. This paper presents thermal management, design concepts and reliability measures of a 1.1 kW C Band solid-state power amplifier. The RF chassis of the SSPA 1.1 kW C Band amplifier has been realized in a 6 ru chassis compared to 7ru for the TWTA amplifiers for the same RF power. When both the semiconductor reliability and the system reliability is considered, the SSPA reliability is clearly far superior to the TWTA reliability.
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