Recent Developments in Signal Integrity and Theory Practice
High Frequency Electronics
At these frequencies, the physical structure of component packages, p.c. boards, cables, connectors and enclosures becomes large in terms of wavelength. Even “ground” is no longer constant, since signals can propagate along conductive surfaces. Table 1 shows the major issues in signal integrity engineering. These challenges are being addressed by the engineering staffs of OEMs, as well as the vendors of EDA tools, test equipment, foundry services, and p.c. board or contract assembly services.
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