The ubiquity of IoT devices has proportionally increased the need for wireless and seamless connections to the internet. In line with this trend, USI has launched the WM-BZ-ST-55 dual-core Bluetooth 5.0 Antenna-on-Package (AoP) module that capitalizes on its proprietary heterogeneous integration and miniaturization technology. The WM-BZ-ST-55 AoP module is an eco-friendly product with the energy-saving feature of using low power consumption. It’s an ideal Bluetooth module for applications like remote sensors, wearable trackers, building automation controllers, computer peripherals, UAVs, and other IoT devices.
Key features of WM-BZ-ST-55:
- The WM-BZ-ST-55 AoP module features STMicroelectronics' STM32L4 Arm Cortex-M4 MCU with the Cortex-M0 + dedicated kernel-managed RF chip.
- This freestanding compact module is packaged with partial metal sputtering shielding, includes STMicroelectronics' (STM) STM32WB55 series RF SoC that supports BLE5.0, Zigbee, and Thread wireless connection, incorporating BTLE and integrated with a 2.4 GHz antenna.
- It is available in an AoP module that measures 7.2 x 9.3 x 0.96 mm.
"Traditional Bluetooth modules were often excessively large in size or paired with external antennas due to the difficulty in reducing the antenna size," said Kevin Lan, GM of Wireless & Mobility Solutions BU, USI. "By employing USI's Antenna-on-Package technology and selected conformal shielding process, we can integrate the Bluetooth with the antenna and reduce the size smaller than a single IC in a BGA package. Furthermore, we design the WM-BZ-ST-55 module with a built-in Cortex-M4 microcontroller that not only offers cost savings for customers' chip designs. It can also incorporate in a wide range of space-constrained IoT devices."
In addition to combining features that meet stringent customer requirements with USI’s leading-edge miniaturization technology, the WM-BZ-ST-55 AoP module utilizes computer-aided simulation software from the beginning of the module design to simulate the antenna efficiency, radiation pattern, and gain. Completing simulation at the initial design stage helps streamline the design process, further shortening the design cycle. USI’s WM-BZ-ST-55 Bluetooth AoP module operates at a temperature range of between -40 and 85 degrees Celsius. The company is currently applying for international certification from communication regulators, including the US (FCC), EU (CE), Canada (IC), etc.
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