Telit Cinterion Launches 5G Module for Bandwidth-Intensive Fixed and Mobile Applications

Telit Cinterion Launches 5G Module for Bandwidth-Intensive Fixed and Mobile Applications

Telit Cinterion, a global enabler of the intelligent edge, has announced the FE990, a 5G sub-6 GHz module series designed for bandwidth-intensive fixed and mobile applications such as industrial IoT, mobile routers, private enterprise networks, and residential broadband. The FE990 features the Snapdragon X62 5G Modem-RF System from Qualcomm.

The FE990 is compatible with 3GPP Release 16, whose advanced features include enhanced mobile broadband (eMBB) and ultra-reliable low-latency communication (URLLC). These features — along with maximum throughputs of 3.4 GB per second downlink and 0.9 GB per second uplink — make the FE990 ideal for bandwidth-intensive applications such as private enterprise networks, 4K and 8K streaming video, mobile routers, drones for public safety, telemetry for agricultural, forestry, and lawn care machinery, residential broadband, telemedicine, and Industry 4.0 factory automation.

Snapdragon X62 helps to maximize the FE990’s power efficiency and transmit/receive performance with advanced technologies such as the new seventh-generation Qualcomm Wideband Envelope Tracking, Qualcomm AI-Enhanced Signal Boost, and Qualcomm 5G PowerSave 2.0. Snapdragon X62 further extends the flexibility offered to operators and devices to increase attainable 5G network speeds and improve capacity with available spectrum. The solution also supports Qualcomm Smart Transmit 2.0 technology, which uses smart control of multiple antennas for superior sub-6 performance.

The FE990 has several features to help service providers, device OEMs, systems integrators, and enterprises quickly launch services, such as regional SKUs for APAC, Europe, and North America. Backward compatibility with LTE and WCDMA also provides deployment flexibility and future-proofing, such as launching 4G broadband services now to capture market share and then upgrading those customers to 5G when it becomes available.

Available in a 41 x 41 mm LGA-type form factor, the FE990 also supports Telit AppZone Linux/C for embedded programming and Telit OneEdge, which dramatically simplifies the design, deployment, and management of IoT products and solutions. Samples of the FE990 are available now, with mass production expected to begin in Q4 2023.

“As a leading technology provider, Qualcomm Technologies is proud to provide cutting-edge innovations like the Snapdragon X62 to partners like Telit. "Our solution is an ideal foundation for the new Telit FE990 to enable optimized modules in the LGA form factor,” said Mathew Joseph, director, product management, Qualcomm Technologies, Inc. “We’re excited to expand our collaboration with Telit Cinterion to enable new form factors and applications that aim to further the 5G promise of advanced performance, reliability, and features for consumers and enterprises.”

“When mobile operators, device OEMs, and systems integrators want to take advantage of the latest 5G technologies, they turn to solutions from Telit Cinterion and Qualcomm Technologies,” said Marco Contento, VP of product management for mobile broadband at Telit Cinterion. “The new Telit FE990 and Snapdragon X62 enable them to quickly and cost-effectively seize many of the biggest emerging market opportunities, from private 5G networks to fixed wireless access to industrial IoT.”

Click here to learn more about the FE990 5G module.

Click here to learn more about the acquisition of Cinterion by Telit.

Publisher: everything RF
Tags:-   LTE4GIoT5GRF Module