Rogers Corporation will be exhibiting some of its highest-performance circuit materials and also share highlights of its extensive research on those materials, at the upcoming DesignCon 2018 event. The exhibition - a premiere event for electronic design engineers working on circuit and system levels - is scheduled to be held from January 31 to February 1, 2018 in the Santa Clara Convention Center in Santa Clara, CA, USA.
Highlights at DesignCon 2018 will include:
Technical Presentation by Rogers’ Al Horn
As part of a diversified technical program at DesignCon 2018, Rogers’ Research Fellow Allen F Horn III will unveil the results of research on how different circuit materials affect the performance of high-frequency analog or high-speed digital transmission lines, in his talk “Effect of Conductor Profile on the Impedance and Capacitance of Transmission Lines”.
On the DesignCon exhibition side, Rogers’ representatives will be available to help visitors achieve optimal performance levels with their circuit materials, with an emphasis on XtremeSpeed RO1200 laminates and RO4835 laminates.
XtremeSpeed RO1200 Laminates
Network equipment designers need high performance circuit materials with superior electrical properties for applications like IP infrastructure, High Performance Computing and Test and Measurement. XtremeSpeed RO1200 circuit materials are engineered to meet the unique electrical and thermal/mechanical demands of high speed designs. They enable system designers the flexibility to design leading edge systems that maximize data throughput and minimize latency in performance demanding applications.
With a low dielectric constant of 3.05, and a maximum dissipation factor of 0.0017 @10 GHz, these laminates provide outstanding signal integrity, reduced signal skew, and reduced cross-talk. Combined with superior thermal/mechanical performance, low CTE, and a halogen free UL 94 V-0 rating, these laminates are well suited for the most demanding high layer count applications.
RO4835 laminates extend Rogers’ portfolio of high performance materials by providing customers with a match to the industry’s most used high frequency material, RO4350B laminates. The material processes similar to FR-4, is automated assembly compatible due to a low z-axis CTE and high Tg, and RO4835 laminates behave very similar to RO4350B materials through lead-free soldering temperatures. Compositionally, RO4835 laminates share the same behavior and benefits of RO4350B materials, with the added benefit of improved long term thermal stability due to the reduced rate of oxidation.